TQP3M9019 high linearity lna gain block applications ? repeaters ? mobile infrastructure ? lte / wcdma / cdma / edge ? general purpose wireless 16-pin 3x3 qfn package product features functional block diagram ? 50-4000 mhz ? 22 db gain @ 1900 mhz ? 1.3 db noise figure @ 1900 mhz ? +39.5 dbm output ip3 ? 50 ohm cascadable gain block ? unconditionally stable ? high input power capability ? +5v single supply, 125ma current ? 3x3 mm qfn package general description pin configuration the TQP3M9019 is a cascadable, high linearity gain block amplifier in a low-cost surface-mount package. at 1.9 ghz, the amplifier typically provides 22 db gain, +39.5 dbm oip3, and 1.3 db noise figure while only drawing 115 ma current. the device is housed in a leadfree/green/rohs-compliant industry-standard 16-pin 3x3mm qfn package. the TQP3M9019 has the benefit of having high gain across a broad range of frequ encies while also providing very low noise. this allows the device to be used in both receiver and transmitter chains for high performance systems. the amplifier is internally matched using a high performance e-phemt process and only requires an external rf choke and bloc king/bypass capacitors for operation from a single +5v supply. the internal active bias circuit also enables stable operation over bias and temperature variations. the TQP3M9019 covers the 0.05 ? 4 ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. pin # symbol 2 rf input 11 rf output / vdd all other pins n/c or gnd backside paddle gnd ordering information part no. description TQP3M9019 high linearity lna gain block TQP3M9019-pcb_rf 0.5-4 ghz evaluation board standard t/r size = 2500 pieces on a 7? reel. data sheet: rev i 04/04/11 - 1 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ?
TQP3M9019 high linearity lna gain block data sheet: rev i 04/04/11 - 2 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature -65 to 150 o c rf input power,cw,50 ? , t=25oc +23 dbm device voltage,v dd +7 v reverse device voltage -0.3 v operation of this device outsi de the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max units vdd 4.75 5 5.25 v tcase -40 +85 o c tch ( for>10 6 hours mttf ) 190 o c electrical specifi cations are measured at sp ecified test conditions. specifications are not guaranteed over all recommended operating conditions. e lectrical specifications test conditions unle ss otherwise noted: +25oc, +5v vsupply, 50 ? system. parameter conditions min typical max units operational frequency range 50 4000 mhz test frequency 1900 mhz gain 20 22 23 db input return loss 10 db output return loss 13 db output p1db +22 dbm output ip3 see note 1. +36 +39.5 dbm noise figure 1.3 db vdd +5 v current, idd 125 150 ma thermal resistance (channel to case) t jc 34 o c/w notes: 1. oip3 is measured with two tones at an out put power of 3 dbm / tone separated by 1 mhz. the suppression on the largest im3 prod uct is used to calculate the oip3 using 2:1 rule. 2:1 ru le gives relative value w.r.t. fundamental tone.
TQP3M9019 high linearity lna gain block application circuit configuration notes: data sheet: rev i 04/04/11 - 3 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ? 1. see pc board layout, page 6 for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. b1 (0 ? jumper) may be replaced with copper trace in the target application layout. 4. the recommended component values are depe ndent upon the frequency of operation. 5. all components are of 0603 size unl ess stated on the schematic. bill of material reference designation TQP3M9019-pcb_rf 500 mhz-4000 mhz q1 TQP3M9019 c2, c6 100 pf c1 0.01 uf l2 68 nh l1, d1, c3, c4 do not place b1 0 ? notes: 1. performances can be optimized at frequency of interest by using recommended compone nt values shown in the table below. frequency (mhz) reference designation 50 200 500 2000 2500 3500 c2, c6 0.01 uf 1000 pf 100 pf 22 pf 22 pf 22 pf l2 470 nh 220 nh 82 nh 22 nh 18 nh 15 nh
TQP3M9019 high linearity lna gain block typical performance 500-4000 mhz test conditions unless otherwise noted: +25oc, +5v, 125 ma, 50 ? system. the data shown below is measured on TQP3M9019-pcb_rf. data sheet: rev i 04/04/11 - 4 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ? notes: 1. oip3 measured with two tones at an output power of +4 dbm / t one separated by 1 mhz. the suppr ession on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board which in cludes board losses of around 0.1db @ 2 ghz. performance plots 16 20 24 28 0.511.522.533.54 gain (db) frequency (ghz) gain vs. frequency over temp -40 c -20 c +25 c +85 c -20 -15 -10 -5 0 0.5 1 1.5 2 2.5 3 3.5 4 s11 (db) frequency (ghz) s11 vs. frequency over temp +85 c +25 c -20 c -40 c -20 -15 -10 -5 0 0.511.522.533.54 s22 (db) frequency (ghz) s22 vs. frequency over temp -40 c -20 c +25 c +85 c 0 1 2 3 4 500 1000 1500 2000 2500 3000 3500 4000 nf (db) frequency (mhz) noise figure vs. frequency over temp +85 c +25 c -40 c frequency mhz 500 900 1900 2700 3500 4000 gain db 25.6 24.6 22 20.5 19 18.3 input return loss db 11 10.5 10 11.5 8 6 output return loss db 10.5 12 13 9 10 11 output p1db dbm +22.4 +22.3 +22 +2 1.7 +2 1.4 +20.8 oip3 [1] dbm +41.8 +40.6 +40.6 +38.5 +38.8 +37.9 noise figure [2] db 0.9 0.9 1.3 1.7 2.1 2.4
TQP3M9019 high linearity lna gain block performance plots 25 30 35 40 45 02468 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over temp f=1900 mhz, 1 mhz tone spacing +25 c 25 30 35 40 45 0.511.522.533.54 oip3 (dbm) frequency (ghz) oip3 vs. frequency over temp 1 mhz tone spacing, 4 dbm/tone +25 c +8 5 c -20 c -40 c +8 5 c -20 c -40 c 25 30 35 40 45 02468 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over freq +25c, 1 mhz tone spacing 1.9 ghz 0.9 ghz 3.5 ghz 16 18 20 22 24 0.511.522.533.54 p1db (dbm) frequency (ghz) p1db vs. frequency over temp -40 c -20 c +25 c data sheet: rev i 04/04/11 - 5 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ? 2. 7 ghz +8 5 c 105 110 115 120 125 130 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 idd (ma) vdd (v) idd vs. vdd t=25 ? c, cw signal 105 110 115 120 125 130 -40 -15 10 35 60 85 idd (ma) temperature ( ? c) idd vs. temperature cw signal
TQP3M9019 high linearity lna gain block typical performance 50-500 mhz test conditions unless otherwise noted: +25oc, +5v, 125 ma, 50 ? system. the data shown below is measured on TQP3M9019-pcb_rf using these component values: c2, c6 = 1000 pf, l2 = 330 nh, c1 = 0.01 uf . data sheet: rev i 04/04/11 - 6 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ? notes: 1. oip3 measured with two tones at an output power of +3 dbm / to ne separated by 1 mhz. the suppr ession on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board which in cludes board losses of around 0.1 db @ 2 ghz . if performance plots 16 20 24 28 0 100 200 300 400 500 gain (db) frequency (mhz) gain vs. frequency over temp -40 c -20 ? c +25 c +85 c -20 -15 -10 -5 0 0 100 200 300 400 500 s11 (db) frequency (mhz) s11 vs. frequency over temp -40 c -20 ? c +25 c +85 c -20 -15 -10 -5 0 0 100 200 300 400 500 s22 (db) frequency (mhz) s22 vs. frequency over temp -40 c +20 c +25 c +85 ? c 0 1 2 3 4 0 100 200 300 400 500 nf (db) frequency (mhz) noise figure vs. frequency over temp +85 c +25 c -40 c frequency mhz 70 100 200 500 gain db 27 26.8 26.4 25.8 input return loss db 12 13 13 13 output return loss db 11 11 12 13 ou tput p1db dbm +21.6 +21.9 +21.9 +22.2 oip3 [1] +37.6 dbm +38.8 +39 +41.4 noise figure [2] 1.4 db 1.3 0.9 0.9
TQP3M9019 high linearity lna gain block if performance plots 25 30 35 40 45 0 100 200 300 400 500 oip3 (dbm) pout / tone (dbm) oip3 vs. frequency over temp 1 mhz spacing, 3 dbm/tone -40 c +25 c 14 16 18 20 22 24 0 100 200 300 400 500 p1db (db) frequency (mhz) p1db vs. frequency over temp -40 c +25 c +85 c +8 5 c data sheet: rev i 04/04/11 - 7 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ?
TQP3M9019 high linearity lna gain block pin description pin symbol description 2 rf input input, matched to 50 ohms. external dc block is required. 11 vdd / rfout output, matched to 50 ohms, external dc block is required and supply voltage all other pins gnd these pins are not connected internally but are recommended to be grounded on the pcb for optimal isolation. gnd paddle backside paddle. multiple vias should be employed to minimize inductance and thermal resistance; see page 7 for suggested footprint. applications information pc board layout top rf layer is .014? nelco n4000-13, ? r = 3.9, 4 total layers (0.062? thick) for mechanical rigidity. metal layers are 1-oz copper. 50 ohm microstrip line details: width = .029?, spacing = .035?. the pa d pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. fo r further technical information, refer to www.triquint.com data sheet: rev i 04/04/11 - 8 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ?
TQP3M9019 high linearity lna gain block mechanical information package information and dimensions this package is lead-free/rohs-compliant. the plating material on the leads is annealed matte tin. it is compatible with both lead- free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. the component will be marked with an ?9019? designator with an alphanumeric lot code on the top surface of package. mounting configuration all dimensions are in millimeters (inches). angles are in degrees. notes: 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. triquint 9019 yyww axxxx data sheet: rev i 04/04/11 - 9 of 10 - disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ?
TQP3M9019 high linearity lna gain block product compliance information esd information solderability compatible with the latest version of j-std-020, lead free solder, 260 this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). esd rating: class 1a value: passes ? 250v to < 500 v test: human body model (hbm) standard: jedec standard jesd22-a114 th is product also has the following attributes: ? lead free esd rating: class iv ? halogen free (chlori ne, bromine) value: passes ? 1000 v ? an timony free test : charged device model (cdm) ? tbbp-a (c 15 h 12 br 4 0 2 ) free st andard: jedec standard jesd22-c101 ? pfos f ree ? svhc free msl rating level 1 at +260 c convection reflow the part is rated mois ture sensitivity level 1 at 260c per jedec standard ipc/jedec j-std-020. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information abou t triquint: web: www.triquint.com tel: +1.503.615.9000 email: info-sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatso ever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and th e entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any part y any patent rights, licenses, or any other intellectual prope rty rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be exp ected to cause severe pers onal injury or death. data sheet: rev i 04/04/11 - 10 of 10 disclaimer: subject to change without notice ? 2010 triquint semiconductor, inc. connec ting the digital world to the global network ?
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